| Authors: | M. Rakowski, M. Pantouvaki, P. De Heyn, P. Verheyen, M. Ingels, H. Chen, J. De Coster, G. Lepage, B. Snyder, K. De Meyer, M. Steyaert, N. Pavarelli, J. Lee, P. O'Brien, P. Absil, J. Van Campenhout | | Title: | A 4x20Gb/s WDM Ring-Based Hybrid CMOS Silicon Photonics Transceiver | | Format: | International Conference Proceedings | | Publication date: | 2/2015 | | Journal/Conference/Book: | 2015 IEEE International Solid- State Circuits Conference
| | Editor/Publisher: | Institute of Electrical and Electronics Engineers, | | Volume(Issue): | p.408 | | Location: | SAN FRANCISCO, United States | | DOI: | 10.1109/ISSCC.2015.7063099 | | Citations: | 41 (Dimensions.ai - last update: 24/11/2024)
4 (OpenCitations - last update: 27/6/2024)
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Abstract
Silicon photonics (SiPh) has been identified as a prime technology targeting cost-effective short-range optical links [1]. Wavelength-division multiplexing (WDM) is an attractive approach for enabling high aggregate transceiver bandwidth without increasing the number of optical fibers used in the link. Ring-based optical modulators and wavelength-selective filters are attractive devices for scalable WDM SiPh transceivers owing to their compact footprint and moderate power required for thermal tuning. In this paper, we report on a thermally controlled ring-based flip-chip integrated CMOS-SiPh transceiver with 4 channels operating at 20Gb/s. Related Research Topics
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