Authors:	D. Van Thourhout, G. Roelkens, J. Van Campenhout, J. Brouckaert, R. Baets
Title:	Technologies for on-chip optical interconnects
Format:	International Conference Proceedings
Publication date:	11/2005
Journal/Conference/Book:	Proceedings of the 18th Annual Meeting of the IEEE Lasers & Electro-Optics Society (LEOS 2005)
Volume(Issue):	p.TuE2 (2 pages)
Location:	Sydney, Australia
DOI:	10.1109/leos.2005.1547950
Citations:	2 (Dimensions.ai - last update: 24/11/2024) 1 (OpenCitations - last update: 3/5/2024) Look up on Google Scholar
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Abstract

We propose an integration approach for on-chip optical interconnect compatible with waferscale processing technologies and future advanced electronic circuits. The use of ultra-compact SOI-based wiring circuitry is demonstrated. First heterogeneously integrated optoelectronic devices coupled to these waveguides are shown.

Related Research Topics

• Die-to-wafer bonding technology (2003-2012)

Related Projects

• IST: PICMOS (Photonic Interconnect Layer on CMOS by wafer-scale integration)