ECSEL: MICROPRINCEFull Name: micro transfer printing on 200mm wafers Duration: 1/4/2017-1/10/2020 (Finished) Partners: - X-FAB MEMS and semiconductor foundries
- Melexis
- X-Celeprint
- Huawei
- Optics Balzers
- Fraunhofer IMWS
- Tyndall
- TU Dresden
Objective: - The MICROPRINCE project is focused on creation of a pilot line for heterogeneous integration of smart systems by micro-transfer-printing (μTP) in a semiconductor foundry manufacturing environment. Functional components like processed III/V devices, optical filters, and special sensors will be transferred to target wafer to demonstrate the capabilities of the technology.
INTEC's Role: - Develop and transfer the micro-transfer printing of III-V opto-electronic components to a foundry environment.
Project Web site: https://microprince.eu People involved
Research topics involved
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